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Q1: Ingabe le Copper Foil Tape ilungele i-Multilayer Board Interlayer Grounding?
A1: Impela. Leli zinga lenzelwe ngokukhethekile ukusetshenziswa kwe-Multilayer Board Interlayer Grounding, linikeza ukusebenza okuhle kakhulu kwe-Acrylic Pressure Sensitive Adhesive ngaphansi kwengcindezi yokushisa engu-150℃.
Q2: Ingabe izoshiya insalela noma yonakalise i-Multilayer Board Interlayer Grounding substrate?
A2: Cha. Inobuchwepheshe bokususa okuhlanzekile, okuqinisekisa indawo engenansalela ngemva kokuxebuka ngaphakathi kwebanga lokushisa elishiwo.
Q3: Ungasinikeza ububanzi obenziwe ngokwezifiso noma izimo ezisikwe nge-die-cut zomugqa wethu wokukhiqiza?
A3: Yebo, sihlinzeka ngokusika okunembile (ububanzi obuncane ±0.1mm) kanye nokusika nge-die-cut okwenziwe ngokwezifiso ngokusekelwe emidwebeni yakho yobuchwepheshe.